Semiconductor Failure Analysis Services
This page provides the service about a semiconductor product from a design to manufacture, and evaluation and analysis.
Semiconductor Failure Analysis, Circuit Editing and Test Services
We present failure analysis of semiconductor devices, edit circuits using Focused Ion Beam (FIB) and test services using a LSI tester.
We offer a broad range of failure analysis service, such as emission microscope (EMS), IR-OBIRCH, EB tester and nanoprober-based analysis.
Analyses also can be performed in the condition under which semiconductor devices are operating on the system, LSI testers and evaluation jigs.
Circuit editing using the Focused Ion Beam (FIB) can be made to copper wiring devices and devices with low-k dielectric films.
We also perform circuit editing from the decapsulation (package removal) and the peeling process of polyimide film.
We offer services related to product tests, such as development of test programs for evaluation, analysis and mass production, test jigs for ATEs, test program conversion for the other ATEs and test application software.
*For more information about our products (Toshiba semiconductor products), please contact the distributor where you purchase our products, our sales representatives or the purchasing support section.
For information about our semiconductor failure analysis service, please see the Toshiba Microelectronics corporation website.