Toshiba Expands Package Line-up of Interface Bridge LSI for LCD Display

June 14, 2013

Enables Layout without Multi-Layer PCB for Cost Saving

TOKYO - Toshiba Corporation (TOKYO: 6502) today announced that it has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablet PC, Ultrabooks™ and other applications. Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.

The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than 4 layers.

Those new package products reduce the set makers' cost of assembly and materials.

Key Features

Ball pitch expanded from 0.4mm to 0.65mm
Optimized pin assignment allows layout with no need for high cost PCB with more than 4 layers

Main specifications

Part Number TC358777XBG[Note 1] TC358778XBG[Note 2]
Maximum Supporting
Resolution
2580 × 2048
(24bit, 60fps)
1900 × 1200
(24bit, 60fps)
Input Interface MIPI 4 lanes × 2ch
(MIPI 1 lane = 1Gbps)
MIPI DPI 24 bit
(Parallel Input)
Output Interface Display Port × 4ch
(Display Port 1 lane = 2.7Gbps)
MIPI 4 lanes
(MIPI 1 lane = 1Gbps)
Package VFBGA80
7mm × 7mm
0.65mm pitch
VFBGA80
7mm × 7mm
0.65mm pitch
Mass production status July, 2013 June, 2013

 

  • [Note 1] Original product part number is TC358770XBG
  • [Note 2] Original product part number is TC358768XBG
  • *: Ultrabook™ is a trademark of Intel Corporation in the US and/or other countries.

 

Customer Inquiries
Logic LSI Sales & Marketing Group
Tel: +81-44-548-2110

 

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

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