On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.
Camera Module Products
[As of April, 2011]
Usage Precautions
- Lens
Take precautions to ensure that dust or dirt do not adhere to the lens surface.
Also, dropping the device or applying strong friction to the lens surface can damage or scratch the lens. Be careful, therefore, when handling the device. - Light and Heat Resistance
Do not use the product for a long time under the strong light such as sunlight.
Doing so may lead to degradation of the micro lens shape, adversely affecting optical characteristics. - Products with Flexible Circuit Boards
Bending or pulling the junction areas may cause separation of the reinforcing resin or junction. Be careful during device handling. - Products with Protective Seals
Do not reuse lens protective seals. Doing so can cause dust and dirt.
On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.





