On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.
General Usage Considerations
[As of April, 2011]
Inspection, Testing and Evaluation
Grounding
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Check that there is no electrical leakage before grounding measuring equipment or a solder iron. Electrical leakage may cause electric shock or the device you are testing or soldering to electrically break down. |
Inspection Sequence
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Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. |
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On the evaluation, inspection or test, be sure to connect the test equipment's electrodes or probes to the pins of the device before turning the power on. When you have finished, discharge any electrical charge remaining in the device. Failure to do so may cause electric shock, resulting in injury. |
- Apply voltage to the device after inserting it into the test jig. At this time, observe the power supply activation or shutdown standards, if existent.
- After test completion, be sure that the voltage applied to the device is off before removing the device from the test jig. Removing the device with the power supply on can cause device deterioration or breakdown.
- Make sure that no surge voltages from the measuring equipment are applied to the device.
- The chips in tape carrier packages (TCPs) are LSI chips and therefore exposed. During inspection, be careful not to crack or scratch the chip.
Electrical contact may also cause chip failure. Therefore make sure that nothing comes into electrical contact with the chip.
On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.