On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.

Design Approval Test Procedures

[As of April, 2011]

Semiconductor reliability tests are performed in the research and development phase and in the mass production phase. During research and development, reliability tests are used to evaluate design quality, materials and processes. During mass production they are used as design approval tests and for periodic reliability monitoring.
As shown in Figure 1, the design approval test (DAT) procedure uses a test element group (TEG) primarily to evaluate the wafer process and package during research and development, and to obtain basic data for design optimization. The product is designed based on this data, and a prototype is used for the DAT. When evaluated, the product is classified into families according to the design rule and package, and reliability testing is performed on a representative product from each family.
The tests performed include electrical characteristics, early failure rate (EFR), long-term lifetime or random failure rate (IFR), threshold and environment tests. Reliability tests for products other than the representative products are mainly based on electrical characteristics and small samples. Table 1 shows an example of a DAT for a typical memory product.

This is [Figure 1 Design Approval Test Procedure].

Figure 1 Design Approval Test Procedure

Table 1 Examples of Design Approval Test for a Typical System LSI Product
1. Si Reliability Tests
Test	Test Conditions	Remarks
High-Temperature Operation	Apply maximum guaranteed operating voltage or accelerated voltage at 125°C.	Test for 1,000 h
High-Temperature Bias	Apply maximum guaranteed operating voltage or accelerated voltage at 125°C.	Test for 1,000 h
High-Temperature Storage	150°C	Test for 1,000 h
Low-Temperature Operation	Apply maximum guaranteed operating voltage or accelerated voltage at −30°C.	Test for 1,000 h

2. Package Reliability Tests
Test	Test Conditions	Remarks
Temperature Humidity Bias	Apply maximum guaranteed operating voltage at 85°C/85%	Test for 1,000 h
High-Acceleration Stress	Apply maximum guaranteed operating voltage at 130°C/85%	Test for 300 h
Temperature Cycling	One cycle consists of −65°C (20 min) followed by 150°C (20 min)	Test for 300 cycles
Pressure Cooker	127°C/100% (2.53 × 10⁵Pa)	Test for 120 h

3. Thermal Environment Tests
Test	Test Conditions	Remarks
Soldering Iron Heat	Soldering temperature: 400°C, applied twice for 3 seconds	Only the leads are immersed
Temperature Cycling	One cycle consists of −65°C (20 min) followed by 150°C (20 min)	Test for 300 cycles
Thermal Shock	One cycle consists of 0°C (5 min) followed by 100°C (5 min), complete transition within 10 s	Test for 100 cycles
Moisture Resistance		Test for 10 cycles

4. Mechanical Tests
Test	Test Conditions	Remarks
Vibration Variable Frequency	100 to 2000 to 100 Hz \| ← (4 min) → \| 200 m/s, applied in 2 or 3 directions, four times each
Mechanical Shock	15000m/s², 0.5 ms, applied in four directions, 3 times each
Constant Acceleration	200000m/s², applied is 6 directions, each for one minute

5. Other
Test	Test Conditions	Remarks
Solderability	Solder bath temperature: 245°C, applied once for five seconds (using flux)	Only the leads are soldered. Leads with solder deposition rates of 95% or higher are considered good.
Salt Atmosphere	Left in 5% salt spray atmosphere at 35°C for 24 h