On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.

Reliability Concept

[As of April, 2011]

Operating and Environment Conditions

The reliability of semiconductor products is determined by stresses caused by electrical loads, ambient environmental loads and mechanical loads applied to the exterior of the product (collectively referred to as external stresses), and the product’s ability to withstand these external stresses (in a broad sense, the product’s strength).
To increase reliability, two things are required: (1) Design products to withstand forces beyond the expected external stress levels, and (2) During use, limit external stress to a level the product can withstand.
External stresses that affect the reliability of semiconductor products are:

Electrical loads during use, such as voltage, current, power and surges
Ambient environmental loads, such as temperature, humidity, gas, dust and radiation
Mechanical loads, such as vibration and shock during installation and transport

In order to increase reliability, Toshiba semiconductor products are designed with a sufficient margin against the normally applied external stresses, such as thermal and mechanical stress. Reducing external stress generally improves the reliability of the equipment in which semiconductors are used.,br> For details of external stress and derating methods (methods used to minimize to the extent possible operating conditions with respect to maximum ratings and increase reliability), refer to the later sections entitled "Factors Affecting Reliability," "Handling Precautions" and "Appendices."