Failure Analysis

[As of Jan, 2010]

• Significance of Failure Analysis
• Instruments Used in Failure Analysis
• Failure Analysis Procedure
  1. Failure Analysis Procedure for General Semiconductor Products
  2. Identifying Failure Locations Using LSI
• Examples of Failure Analysis
  1. ASIC Product Failure Location Identification Using EB Tester Image
  2. Failure Location Identification Using an Emission Microscope
  3. Si Chip Backside Analysis Using an Infrared Emission Microscope (IR EMS)
  4. Failure Location Identification Using IR-OBIRCH
  5. Single Element Failure Analysis using a Nanoprobe System
  6. Failure Location Identification Using an Emission Microscope and EB Tester
  7. Gate Oxide Film Breakdown Analysis Using SEM
  8. Interlayer Particle Analysis
  9. TEM Cross-Sectional Analysis of Failure Location Identified Using OBIC
  10. Analysis of Fine Particles in LSI Using Auger Electron Spectroscopy (1)
  11. Analysis of Fine Particles in LSI Using Auger Electron Spectroscopy (2)
  12. Coupling Status Analysis of Minute Part Using XPS
  13. Junction Analysis Using SCM
  14. Leak Location Identification Using Conductive AFM
  15. Analysis of Bonding Pad Corrosion
  16. Analysis of Cause of Leakage between Metallization on Package Substrate
  17. Analysis of Package Crack by Reflow of Surface Mounted Device
  18. Analysis of a Surface-Mount Device Soldering Failure by Board Used
• Failure Analysis and Reliability Improvement Measures

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    • Semiconductor Device Reliability
      • Failure Analysis
        • Significance of Failure Analysis
        • Instruments Used in Failure Analysis
        • Failure Analysis Procedure
        • Examples of Failure Analysis
        • Failure Analysis and Reliability Improvement Measures
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