On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.

Failure Analysis and Reliability Improvement Measures

[As of April, 2011]

As described in Significance of Failure Analysis, the purpose of failure analysis is to maintain the reliability required of a device. Therefore, failure analysis includes the following objectives:

Investigate the cause of failures that occur during trial production and evaluation and feed back the results to the design process so that reliability can be designed in at the process development stage.
Investigate the cause of failures that occur in the manufacturing process and feed back the results to the manufacturing process to ensure mass production of the developed device at stable quality and reliability levels.
Strive to continuously improve quality and reliability in the manner.
Investigate failures that occur in the field to determine whether the cause lies in the device or in inappropriate use, such as overvoltage, noise or thermal stress, and give proper feedback. If a problem exists with the device, corrective action must be taken, tracing the product's history back to the design or manufacturing process.

Figure 1 illustrates this procedure.

This is [Figure 1 Procedure for Improving Reliability by Failure Analysis].

Figure 1 Procedure for Improving Reliability by Failure Analysis