Examples of Failure Analysis

[As of April, 2011]

This section describes the representative failure analysis methods and results using the following 18 examples:

1. ASIC Product Failure Location Identification Using EB Tester Image
2. Failure Location Identification Using an Emission Microscope
3. Si Chip Backside Analysis Using an Infrared Emission Microscope (IR EMS)
4. Failure Location Identification Using IR-OBIRCH
5. Single Element Failure Analysis using a Nanoprobe System
6. Failure Location Identification Using an Emission Microscope and EB Tester
7. Gate Oxide Film Breakdown Analysis Using SEM
8. Interlayer Particle Analysis
9. TEM Cross-Sectional Analysis of Failure Location Identified Using OBIC
10. Analysis of Fine Particles in LSI Using Auger Electron Spectroscopy (1)
11. Analysis of Fine Particles in LSI Using Auger Electron Spectroscopy (2)
12. Coupling Status Analysis of Minute Part Using XPS
13. Junction Analysis Using SCM
14. Leak Location Identification Using Conductive AFM
15. Analysis of Bonding Pad Corrosion
16. Analysis of Cause of Leakage between Metallization on Package Substrate
17. Analysis of Package Crack by Reflow of Surface Mounted Device
18. Analysis of a Surface-Mount Device Soldering Failure by Board Used

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