On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.
Failure Location Identification Using an Emission Microscope and EB Tester
[As of April, 2011]
- Purpose
Function leakage failure during reliability test - Analysis and Result
With the IC set in a standby state, light emission from multiple locations was observed using an emission microscope. Furthermore, locations with open wiring were identified using an EB tester. Particles were subjected to cross-sectional processing using FIB, resulting in the identification of open Al metallization.
Metallization that started to disconnect due to particles completely disconnected as a result of stress.
![This is [Figure 1 Light Emission Image by EMS].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-019_z04-10_250.jpg "This is [Figure 1 Light Emission Image by EMS].")
Figure 1 Light Emission Image by EMS
![This is [Figure 2 Observation by EB Tester].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-019_z04-11_300.jpg "This is [Figure 2 Observation by EB Tester].")
Figure 2 Observation by EB Tester
![This is [Figure 3 Cross-Section of Disconnected Location].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-019_z04-12_350.jpg "This is [Figure 3 Cross-Section of Disconnected Location].")
Figure 3 Cross-Section of Disconnected Location
On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.