On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.

Interlayer Particle Analysis

[As of April, 2011]

Purpose
To find out the cause and location of Al metallization open due to particles.
Analysis and Result
Disconnected Al metallization opens were identified using the SEM charge-up technique, and a cross-section was prepared using an FIB and observed. The particle was identified using EPMA analysis.
Al metallization was disconnected due to particle adhesion from the manufacturing equipment used in the interlayer formation process.

This is [Figure 1 Identification of Open Location].

Figure 1 Identification of Open Location

This is [Figure 2 SEM Image of Particle].

Figure 2 SEM Image of Particle

This is [Figure 3 SEM Image].

Figure 3 SEM Image

This is [Figure 4 EPMA Fe X-ray Image].

Figure 4 EPMA Fe X-ray Image

This is [Figure 5 EPMA Cr X-ray Image].

Figure 5 EPMA Cr X-ray Image