On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.
Analysis of Bonding Pad Corrosion
[As of April, 2011]
- Purpose
Open failure after humidity test - Analysis and Result
After sealing resin removal, an abnormality was found in a bonding pad area electrically opened. As a result of analysis using an EPMA, Al elution was confirmed and the impurity Cl was detected. Figure 1 b) c)]
Al corrosion of bonding pad area by Cl contamination
![This is [Figure 1 Example of Al Corrosion Analysis of Bonding Pad Area].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-028_z04-37_450.jpg "This is [Figure 1 Example of Al Corrosion Analysis of Bonding Pad Area].")
Figure 1 Example of Al Corrosion Analysis of Bonding Pad Area
On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.