On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.
Analysis of Package Crack by Reflow of Surface Mounted Device
[As of April, 2011]
- Purpose
To find out the cause of package cracks and bonding opens after moisture absorption and VPS reflow. - Analysis and Result
A package crack from the edge of the chip was detected by scanning acoustic tomography observation, X-ray fluoroscopy observation and cross-sectional observation.
Internal moisture vaporized due to thermal stress at the time of VPS and, because the vapor pressure exceeded the rupture strength of the resin, the package cracked, causing the wire to break.
![This is [Figure 1 Observation by Scanning Acoustic Tomography].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-030_z04-40_250.jpg "This is [Figure 1 Observation by Scanning Acoustic Tomography].")
Figure 1 Observation by Scanning Acoustic Tomography
![This is [Figure 2 Observation by X-ray Fluoroscopy (Wire Open)].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-030_z04-41_250.jpg "This is [Figure 2 Observation by X-ray Fluoroscopy (Wire Open)].")
Figure 2 Observation by X-ray Fluoroscopy (Wire Open)
![This is [Figure 3 Cross-Sectional Observation].](/eng/product/reliability/device/analysis/analysis4/__icsFiles/artimage/2009/10/28/ec_relia5_54/E_04-030_z04-42_250.jpg "This is [Figure 3 Cross-Sectional Observation].")
Figure 3 Cross-Sectional Observation
On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes reliability information of semiconductor products.