IC packages
Refer to an appropriate datasheet when you use any of these packages.
Through-Hole Packages
| Style(EIAJ) | Package | Characteristics | Material | |
|---|---|---|---|---|
| Dual In-Line | DIP | DIP | Leads are on two opposite sides of the package. | Plastic |
| SDIP | DIP with a shrunk lead pitch | Plastic | ||
| HDIP | DIP with a heat sink | Plastic | ||
| WDIP | DIP with a permeable window or DIP encapsulated with permeable resin | Plastic/ Ceramic |
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| Single In-Line | SIP | SIP | Leads are on one side of the package in a straight line. | Plastic |
| SSIP | SIP with a shrunk lead pitch | Plastic | ||
| HSIP | SIP with a heat sink | Plastic | ||
| ZIP | ZIP | Leads protrude from two opposite sides of the package in a staggered configuration. | Plastic | |
| SZIP | ZIP with a shrunk lead pitch | Plastic | ||
| HZIP | ZIP with a heat sink | Plastic | ||
| Area Array | PGA | PGA | Leads are on the top or bottom of the package in area array format. | Plastic/ Ceramic |
| HPGA | A heat sink is attached internally, and leads are on the top or bottom of the package in either peripheral or area array format. | Plastic/ Ceramic/ Glass Shield |
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Surface-Mount Packages
| Style(EIAJ) | Package | Characteristics | Material | |
|---|---|---|---|---|
| Peripheral Leads | QFP | QFP | Leads are on four sides of the package in a gull wing configuration. | Plastic/ Ceramic/ Glass Shield |
| HQFP | Thermally-enhanced QFP with either a radiation fin on its leads or an internal heat spreader under the die | Plastic | ||
| LQFP | QFP with a seated height of 1.7 mm | Plastic | ||
| TQFP | QFP with a seated height of 1.2 mm or less | Plastic | ||
| QFJ | QFJ | Leads are on four sides of the package and are bent downward in the shape of letter J. | Plastic | |
| QFN | QFN | Leads are on four sides and the bottom of the package. | Plastic | |
| QON | QON | - | Plastic | |
| Two-Sided Leads | SOP | SOP | Leads are on two opposite sides of the package in a gull wing configuration. | Plastic |
| SSOP | SOP with a lead pitch of 1.0 mm or less | Plastic | ||
| HSOP | Thermally-enhanced SOP with either a radiation fin on its leads or an internal heat spreader under the die | Plastic | ||
| TSOP I | SOP with a seated height of 1.2 mm or less, a lead pitch of 0.8 mm or less. Leads are on the short sides in a gull wing configuration. | Plastic | ||
| TSOP II | SOP with a seated height of 1.2 mm or less, a lead pitch of 1.27 mm or less. Leads are on the long sides in a gull wing configuration. | Plastic | ||
| TSSOP | SSOP with a seated height of 1.2 mm or less | Plastic | ||
| VSSOP | SSOP with a seated height of 1.0 mm or less | Plastic | ||
| ESOP | - | Plastic | ||
| WSOP | SOP with a permeable window or DIP encapsulated with permeable resin | Plastic | ||
| SHP | SHP | SVP designed for horizontal mounting | Plastic | |
| SOL [JEDEC]standard |
SOL [JEDEC]standard |
Leads are on two opposite sides of the package in a gull wing configuration. | Plastic | |
| SOJ | SOJ | Leads are on two opposite sides of the package and are bent downward in the shape of letter J. | Plastic | |
| SON | SON | Leads are on two opposite sides and the bottom of the package. | Plastic | |
| CSON | - | Ceramic | ||
| Single Row of Vertical Leads | SVP | SVP | Leads are on one side of the package and are bent in the shape of letter L | Plastic |
| Area Array | BGA | BGA | An array of solder balls are over or underneath the package. | Plastic/ Ceramic |
| FBGA | 1.2mm<FBGA BGA with a minimum ball pitch of 0.8 mm or less and a maximum seated height of over 1.2 mm |
Plastic | ||
| TFBGA | 1.0mm<TFBGA≤1.2mm BGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 1.0 mm and a maximum seated height of 1.2 mm or less |
Plastic | ||
| VFBGA | 0.8mm<VFBGA≤1.0mm BGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 0.8 mm and a maximum seated height of 1.0 mm or less |
Plastic | ||
| WFBGA | 0.65mm<WFBGA≤0.8mm BGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 0.65 mm and a maximum seated height of 0.8 mm or less |
Plastic | ||
| UFBGA | 0.5mm<UFBGA≤0.65mm BGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 0.5 mm and a maximum seated height of 0.65 mm or less |
Plastic | ||
| XFBGA | XFBGA≤0.50mm BGA with a minimum ball pitch of 0.8 mm or less and a maximum seated height of 0.5 mm or less |
Plastic | ||
| LGA | LGA | Land grid array with a standoff height of 0.1 mm or less and a maximum seated height of over 1.2 mm | Plastic | |
| TFLGA | 1.0mm<TFLGA≤1.2mm LGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 1.0 mm and a maximum seated height of 1.2 mm or less |
Plastic | ||
| UFLGA | 0.5mm<UFLGA≤0.65mm LGA with a minimum ball pitch of 0.8 mm or less, a minimum seated height of over 0.5 mm and a maximum seated height of 0.65 mm or less |
Plastic | ||
| XFLGA | XFLGA≤0.50mm LGA with a minimum ball pitch of 0.8 mm or less and a maximum seated height of 0.5 mm or less |
Plastic | ||