Low Current Drive 5 Mbps Logic IC Couplers: TLP2355, TLP2358

As further downsizing of boards has led to them being packaged at higher densities in the industrial equipment and household appliance fields, demands for the elements that make up these boards to consume low power and to be guaranteed to operate at high temperatures have increased. To meet these demands, Toshiba has released the TLP2355 and TLP2358, which are small SO6 package 5Mbps high-speed IC couplers.
The TLP2355 and TLP2358 are the SO6 package version of the MFSOP6 package lineup, the TLP105 and TLP108. These products have a wider operating power-supply voltage range and operating ambient temperature range, while maintaining low input current characteristics (I_FT=1.6mA (max.)). They have a wider operating power-supply voltage range in the low voltage side (V_CC = 3 to 20V (vs. V_CC = 4.5 to 20V in the TLP105)) and can now operate at a 3.3V power-supply voltage. In addition, they can operate at high temperatures, supporting an operating ambient temperature T_opr ≤ 125°C (vs. T_opr ≤ 100°C in the TLP105).
Though compact, the TLP2355 and TLP2358 support low-power consumption and high-temperature operation. For this reason, they can be used in a wide range of applications for industrial purposes as communication interfaces (RS232, RS422, RS485, etc.), data communication solutions for different voltage circuits, and IPM drivers for factory automation (FA) devices. The TLP2355 and TLP2358 are a buffer logic IC coupler and inverter logic IC coupler, respectively.