IGBT Gate Driver Photocouplers: TLP351H, TLP701H
Provides direct drive for small power IGBTs and MOSFETs operating at up to 125℃.
In recent years, with an increase in packing density on printed circuit boards in industrial and consumer products, there is a tendency for on-board semiconductor components to heat up to high temperatures. This translates to an increase in demand for guaranteed performance over a wide operating temperature range and reliability under high ambient temperatures for such semiconductor components. To address such demands, Toshiba has developed two photocouplers, TLP351H and TLP701H. Besides being able to directly drive small power IGBTs and MOSFETs alike, these newly-developed photocouplers offer a guaranteed maximum operating temperature of 125℃, up from 100℃ of their current products, TLP351 and TLP701.
- TLP351H (DIP8 Package)
- The TLP351H photocoupler housed in the DIP8 package can directly drive the gate of small power IGBTs and MOSFETs. Due to the adoption of a newly developed LED, the TLP351H offers a guaranteed operating temperature range from -40℃ to 125℃. Like its current products, the TLP351, the TLP351H is fabricated using a BiCMOS process and thus requires a supply current not exceeding 2 mA, and features the lowest power consumption in the industry (Note 1). The TLP351H is suitable for home appliances and industrial applications that constantly operate under high-temperature conditions.
- TLP701H (SDIP6 Package)
- The TLP701H photocoupler housed in the SDIP6 package can directly drive the gate of small power IGBTs and MOSFETs. While occupying approximately one-half of the footprint size of the DIP8 package, the TLP701H is compliant with the reinforced insulation requirements of international safety standards (pending VDE approval). The TLP701H also offers a guaranteed operating temperature range from -40℃ to 125℃ due to the adoption of the same LED as the TLP351H.
- Note 1: According to a survey of IGBT/power-MOSFET gate driver photocouplers conducted by Toshiba Corporation in May 2010.
Pin Configurations
Package Dimensions
- Note 2: Long creepage distance and surface-mount options are available for lead forming. For details, please refer to its respective technical datasheet.
- Note 3: A long creepage distance option is available for lead forming. For details, please refer to its respective technical datasheet.
Comparisons with the existing products
| Parameter | Symbol | Current Device | New Device | Current Device | New Device |
|---|---|---|---|---|---|
| TLP351 | TLP351H | TLP701 | TLP701H | ||
| Package | PKG | DIP8 | SDIP6 | ||
| Peak output current (max) | IOPH / IOPL | ±0.6 A (max) | |||
| Operating temperature | Topr | -40 to 100℃ | -40 to 125℃ | -40 to 100℃ | -40 to 125℃ |
| Operating voltage range | Vcc | 10 to 30 V | |||
| Supply current | Icc | 2 mA (max) | |||
| Propagation delay time | tpLH / tpHL | 0.7 µs (max) | |||
| Common-mode transient immunity | CMH / CML | ±10 kV/µs (min) (Note 4) | ±15 kV/µs (min) | ±10 kV/µs (min) (Note 4) | ±15 kV/µs (min) |
| Isolation voltage (min) | BVs | 3750 Vrms (min) | 5000 Vrms (min) | ||
- Note 4: Will be upgraded to ±15 kV/µs (min).