Ultra-Small SSOP Photorelays: TLP32xx Series
The TLP32xx Series is the smallest photorelays among the existing Toshiba photorelays. Besides, it offers the industries' smallest size*2 among those housed in a SSOP package*1.
Toshiba has been leading the industry by introducing newly developed devices fabricated using advanced process technologies one after another. These technologies are well-proven in a number of semiconductor testers that are required to offer small size and good electrical characteristics.
Applications for equipment such as factory automation (FA), security and medical equipment are required to allow high-density mounting, since they become increasingly smaller and incorporate increasingly more functions. To meet these requirements, reducing the size of the devices to be incorporated in such applications is essential. This series is thus developed to meet such needs of the times. This series is offered in a wide variety of off-state voltages (VOFF) and on-state currents (ION), among which the highest are 100 V and 0.9 A, respectively, to meet various customer demands. Toshiba will further expand this series.
- *1: Devices housed in a SSOP package (including both Toshiba's and other companies' products)
- *2: As of Nov. 2008, based on Toshiba's survey

Features
- Ultra-small SSOP package
(The base and mounting areas are 60% and 40%, respectively, of those of the conventional 2.54SOP4.) - Reduced mounting area due to a package slightly smaller than that of competing devices
- Various choices for various applications: 13 devices
- Provides electrical characteristics excelling those of other companies' devices, since they are fabricated using advanced MOS process technology
- Device with minimum on-resistance: TLP3203 0.18 Ω (typ.)
- Device with minimum off-state capacitance:TLP3240 0.45 pF (typ.)
- UL-approved: UL1577 (File No. 67349)
Application Examples
- Semiconductor testers
- Factory automation (FA) equipment
- Machine tools
- Medical equipment
- Wireless applications
- Security systems
- Amusement equipment
Package Details

Pin Assignment and Internal Circuit

Product Offerings ( 1-Form-A )
| Part Number | VOFF (max) [V] |
ION (max) [A] |
RON [Ω] | COFF (typ.) [pF] |
IFT (max) [mA] |
tON [µs] | tOFF [µs] | |||
|---|---|---|---|---|---|---|---|---|---|---|
| (typ.) | (max) | (typ.) | (max) | (typ.) | (max) | |||||
| TLP3230 | 20 | 0.16 | 5.0 | 8.0 | 1 | 4 | 60 | 500 | 120 | 500 |
| TLP3250 | 20 | 0.2 | 3.0 | 5.0 | 0.8 | 3 | 26 | 200 | 45 | 200 |
| TLP3231 | 20 | 0.5 | 0.8 | 1.2 | 5 | 4 | 200 | 500 | 200 | 500 |
| TLP3203 | 20 | 0.90 | 0.18 | 0.22 | 40 | 3 | 300 | 2000 | 200 | 1000 |
| TLP3213 | 40 | 0.08 | 25 | 35 | 0.6 | 4 | 50 | 500 | 90 | 500 |
| TLP3216 | 40 | 0.12 | 10 | 15 | 1 | 4 | 50 | 500 | 120 | 500 |
| TLP3240 | 40 | 0.12 | 12 | 14 | 0.45 | 3 | 26 | 200 | 140 | 300 |
| TLP3241 | 40 | 0.14 | 7.0 | 10 | 0.7 | 3 | 26 | 200 | 45 | 200 |
| TLP3214 | 40 | 0.25 | 2.0 | 3.0 | 5 | 4 | 120 | 500 | 140 | 500 |
| TLP3215 | 40 | 0.3 | 1.0 | 1.5 | 10 | 4 | 200 | 500 | 200 | 500 |
| TLP3212 | 60 | 0.4 | 1.0 | 1.5 | 20 | 5 | 300 | 1000 | 200 | 1000 |
| TLP3217 | 80 | 0.12 | 7.5 | 12 | 5 | 5 | 100 | 250 | 150 | 200 |
| TLP3220 | 100 | 0.08 | 8.0 | 14 | 6 | 5 | 100 | 300 | 100 | 300 |
- (Ta=25°C)







