MCP Memory
Advanced functions such as those that allow the playing and storing of still images, movies, and music data or the playing of games are increasingly being incorporated into mobile devices such as cell phones. To this end, there is a need to process large amounts of data faster. At the same time, there is increasing need for a multi-layer multi-chip package (MCP) because these functions must be mounted to a limited space in a package.
Features
- A wide range of combinations can be configured using our extensive line-up of memory LSI.
- Nine-layer stacked MCPs with a thickness of 1.4 mm (including spacers) and five-layer stacked MCPs with a thickness of 1.0 mm (including spacers) are being mass produced to take advantage of the latest MCP packaging technologies.
- The mass production of mobileLBA-NAND, a large-capacity NAND flash memory product that reduces the burden on the host controller, has started. This product enables you to set any size for an SLC area, which is suitable for fast read and write operations, and an MLC area, which is suitable for storing large amounts of data, in the same device. The line-up for this product ranges from models with a total capacity of 4 to 16 Gbits.
MCP Lineup
In addition to a RAM (Pseudo SRAM or SDRAM) and a Flash memory (NOR or NAND) of various capacities, a NAND Flash controller (eSD or e･MMC™) can be integrated in a single package.
