Level Shifter for SD Memory Cards: T3GF3WBG
In most cases, external memory cards are used to store music, video, and other data on mobile phones. However, as the shift to using lower voltages in mobile phones due to the CPUs they use providing higher performance with lower power consumption, the importance of electrical conversion between card and phone has been increasing. In addition, as mobile phones themselves are becoming smaller, it is required that their components become even smaller and more integrated. In light of the above, an ultra-compact voltage level translation IC, T3GE9WBG, is available that, in addition to signal level translation functionality, incorporates peripheral components - namely, an ESD protection device, an EMI filter, and an LDO - and employs WCSP. However, now a new IC, T3GF3WBG, has been developed that is compliant with advanced SD communications standards.
T3GF3WBG is a level shifter that is compliant with the standards for high-speed interfaces, SDR12, SDR25, and DDR50, in SD Memory Card Specification Version 3.0. As it is also compliant with DS mode, which has a 3.3 V signal voltage, and HS mode, T3GF3WBG is also compatible with SD Memory Card Specification Version 2.0 as used by conventional SD interfaces. The ultra-compact WCSP25 package is used, contributing to reductions in mounting area.

Features
- Compliant with SD memory Card Specification Version 3.0 (SDR12, SDR25, DDR50).
- Bidirectional level translation between CPU (1.8 V) and SD memory card (2.9/1.8 V) is possible.
- As a feedback clock terminal to the CPU is included, this IC compensates for delay.
- Compliant with the ESD standard (IEC61000-4-2 Level 4 (contact discharge): ±8 kV) (Terminal on SD memory card side)
- An EMI filter and a pull-up/pull-down resistor is incorporated. (Terminal on SD memory card side)
- A smaller mounting area can be achieved with the small package: WCSP 25 (0.4 mm pitch) package
Uses
- Signal level translation for SD cards.
Mainly for mobile phones, DSCs, DVCs, and other small devices.
Outline Drawing

Pin configuration (Top view)

Circuit Example

Main Specifications
| Parameter | Symbol | Rating | Unit | |
|---|---|---|---|---|
| Supply voltage | VCCA | 1.65 to 1.95 | V | |
| VBatt | 3.1 to 5.0 | V | ||
| Input voltage | DIR, Clk.h | VIN | 0 to VCCA | V |
| Enable, SEL | 0 to 5.0 | |||
| Input/output voltage | VI/OA | 0 to VCCA ("H" or "L") | V | |
| VI/OB | 0 to VCCB ("H" or "L") | |||
| Output current | IOUTA | ±6 (VCCA=1.65 to 1.95V) | mA | |
| IOUTB | ±6 (VCCB=2.8 to 3.0V) | |||
| Operating temperature | Topr | -30 to 85 | °C | |
| Propagation delay time | tpd | tpd=5.0ns(max) (VCCA=1.8±0.15V, VCCB=2.9±0.1V) tpd=7.0ns(max) (VCCA=1.8±0.15V, VCCB=1.8±0.1V) |
ns | |





