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Ultra-Small (US) Packages : TC74VHC/VHCT/LCX/VCX Series

As the sizes of application sets are being reduced, smaller and thinner semiconductor packages that allow easy board assembly are increasingly required.

The conventional TC74VHC/VHCT/LCX/VCX Series are mainly housed in TSSOP packages. To meet the growing demands for smaller packages, Toshiba has now developed the TC74VHC/VHCT/LCX/VCX Series that are housed in 14-/16-/20-pin US packages. This extends the variety of devices offered in lead-type packages allowing for smaller application size.

These devices are best suited for applications that require small form factor solutions, such as car navigation systems, small liquid crystal boards, small mobile handsets and amusement equipment.

Features

Package Details

The illustration of Package Details

About the TC7MH/MET/MZ/MA Series

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