Ultra-Small (US) Packages : TC74VHC/VHCT/LCX/VCX Series
As the sizes of application sets are being reduced, smaller and thinner semiconductor packages that allow easy board assembly are increasingly required.
The conventional TC74VHC/VHCT/LCX/VCX Series are mainly housed in TSSOP packages. To meet the growing demands for smaller packages, Toshiba has now developed the TC74VHC/VHCT/LCX/VCX Series that are housed in 14-/16-/20-pin US packages. This extends the variety of devices offered in lead-type packages allowing for smaller application size.
These devices are best suited for applications that require small form factor solutions, such as car navigation systems, small liquid crystal boards, small mobile handsets and amusement equipment.
Features
- US package, which is one of the industry's smallest packages among lead-type packages
- 0.5-mm lead pitch for easy implementation
- Lead (Pb)-free
Package Details

About the TC7MH/MET/MZ/MA Series
- The TC74VHC/VHCT/LCX/VCX Series offers devices with the same characteristics and packages as for the TC7MA/MZ/MH/MET Series. The TC74VHC/VHCT/LCX/VCXxxxFK is recommended for use in new designs.
- Please click a recommended series.
To customers who intend to use the TC7MH/MET/MZ/MA Series Relevant Series Recommended Series TC7MH Series TC74VHC Series TC7MET Series TC74VHCT Series TC7MZ Series TC74LCX/LVX Series TC7MA Series TC74VCX Series





