Display Interface Bridge

Toshiba's Display Interface Bridge has various display interfaces to facilitate design of feature-rich mobile equipment realizing superb picture quality.

Block Diagram of Display Interface Bridge.

 

Examples of Display Interface Bridge Configurations

Examples of Display Bridge Configurations

HDMI® to MIPI® DSI Converter IC /TC358779XBG

TC358779XBG is the industry's first High-Definition Multimedia Interface (HDMI®) to MIPI® Display Serial Interface (DSI) bridge IC for consumer and industrial applications with a small-form-factor LCD display. Mass production is scheduled to start in February 2014.

The TC358779XBG converts HDMI® video input into a MIPI® DSI video stream, making it possible to use an MIPI®-compliant small-form-factor LCD display in game accessory and wearable computer applications.

The TC358779XBG also integrates video preprocessing functions, video de-interlacing, scaling and format conversion, as wel las multiple audio interfaces, including I2S, TDM, S/PDIF and MIPI® Serial Low-power Inter-chip Media Bus (SLIMbus®).

Key Features

The industry's first device that converts HDMI® video input and outputs it as a MIPI® DSI video stream.
Integrated video de-interlacing, scaling and format conversion contribute to lower memory bandwidth and video processing requirements on host processors.
HDMI® 1.4 RX support
  • Up to 1080P @ 60fps video format (RGB, YCbCr444: 24-bpp, YCbCr422 24-bpp)
  • HDCP 1.3
  • 3D support
Available in any of the four audio interfaces: I2S, TDM, SPDIF or SLIMbus®
Maximum 1Gbps/lane link speed MIPI® DSI interface
Maximum 165MHz clock speed HDMI® interface

Applications

A wide range of consumer electronics and industrial applications, including mobile devices, digital cameras and gaming accessories, head-mounted products and other wearable computers.

Main Specifications

Part Number TC358779XBG
Package Image
The product photograph of TC358779XBG.
Input Interface HDMI® 1.4
Max. clock speed 165MHz
Output Video Interface MIPI® DSI 4 Data lanes (Up to 1Gbps/lane)
Output Audio Interface I2S, TDM, SPDIF or SLIMbus®
Source Voltage MIPI®/Core/PLL: 1.2V
HDMI®: 3.3V
I/O: 1.8V to 3.3V
Package BGA80 (80 balls) 7.0mm×7.0mm, 0.65mm ball pitch
Mass Production Schedule February, 2014
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)

 

Notes:

  • [1]: As of October, 2013. Research by Toshiba Corporation.
  • * HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
  • * MIPI and SLIMbus are registered trademarks of MIPI Alliance, Inc.

Interface Bridge with Backlight Level Controller for LCD Displays TC358771XBG/TC358772XBG

Key Features

Reduces mobile device power consumption by optimizing display backlighting to meet ambient light conditions.
Maintains image detail in darker areas of the display by analyzing and processing brightness data in lighter and darker areas of the image.
Reduces LSI power consumption with a 1.8V LVDS operating system.
Maximum 1Gbps/lane link speed MIPI-DSI interface
Maximum 945Mbps/lane link speed LVDS interface

 

Lineup

Part number TC358771XBG TC358772XBG
Package Image
The product photograph of TC358771XBG.
The product photograph of TC358772XBG.
Maximum resolution support 1600 × 1200
(24bit, 60fps)
1920 × 1200
(24bit, 60fps)
MIPI-DSI input lane Four lanes Four lanes
LVDS output link Single Link Dual Links
Power Supply Voltage 1.2 V (Core),
1.2 V (MIPI® D-PHY I/O),
1.8 V (LVDS PHY)
1.8 V-3.3 V (I/O)
Package BGA49 (49 balls)
5 mm×5 mm、0.65 mm ball pitch
BGA64 (64 balls)
6 mm×6 mm、0.65 mm ball pitch
Sample schedule April 2013 March 2013
Mass production schedule October 2013 September 2013

 

DPI/DBI to DSI-Display Interface Bridge /TC358763XBG

Features

  • LCD-I/F: MIPI®3 DSI lanes
  • Multiple display bridges:
    (DPI/DBI→DSI)
  • Resolution: Up to qHD, WSVGA, XGA (DPI-to-DSI mode)

General Specifications

  • Host I/F:DPI 24bit/DBI-B 16/18bit
  • LCD I/F:DSI
General Specifications of the TC358763XBG
Part number TC358763XBG
Package Image
The product photograph of TC358763XBG.
Supply voltages 1.2 V (Core), 1.2 V (MIPI® D-PHY I/O),
1.8 V-3.3 V (I/O)
Package dimensions BGA72 (72 balls)
4.5 mm × 4.5 mm, 0.4 mm ball pitch
Status/Availability Mass Production
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)

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MIPI® Display Interface Bridge /TC358762XBG

Features

  • Host interface: MIPI® DSI
  • Parallel display outputs: MIPI® DBI Type B, MIPI® DPI
  • SPI, MIPI® DBI Type C and GPIOs for traditional peripheral interfaces, and I2C interface for internal register access
  • qHD @70 fps (MIPI® DPI), FWVGA @60 fps (MIPI® DBI Type B)
  • The source of the internal system clock is selectable from the DSI Clock or a clock derived by multiplying an external clock with on-chip PLL..

General Specifications

General Specifications of the TC358762XBG
Part number TC358762XBG
Package Image
The product photograph of TC358762XBG.
Supply voltages 1.2 V (Core), 1.2 V (MIPI® D-PHY I/O),
1.8-3.3 V (I/O)
Package dimensions BGA64 (64 balls)
5.0 mm × 5.0 mm, 0.5 mm ball pitch
Status/Availability Mass Production
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)

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MIPI® DSI to LVDS Display Interface Bridge /TC358764XBG/TC358765XBG

Features

  • Host interface: MIPI® DSI(4 DSI RX lanes)
  • Single Link (TC358764XBG), Dual Link (TC358765XBG)
  • I2C (master) and GPIO interfaces for peripheral device control and I2C (slave) interface for on-chip register programming
  • TC358764XBG: Up to WXGA resolution (1366 × 768, 24 bpp)
    TC358765XBG: Up to WUXGA resolution (1920 × 1200, 18 bpp; 1600 × 1200, 24 bpp)

General Specifications

General Specifications of the TC358764XBG, TC358765XBG
Part number TC358764XBG TC358765XBG
Package Image
The product photograph of TC358764XBG.
The product photograph of TC358765XBG.
Supply voltages 1.2 V (Core), 1.2 V (MIPI® D-PHY I/O),
3.3 V (LVDS I/O), 1.8-3.3 V (I/O)
Package dimensions BGA49 (49 balls)
5.0 mm × 5.0 mm, 0.65 mm Ball pitch
BGA64 (64 balls)
6.0 mm × 6.0 mm, 0.65 mm Ball pitch
Status/Availability Mass Production
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)

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MIPI® DSI/DPI to DisplayPort® Display Interface Bridge /TC358766XBG

Features

  • Host interface: MIPI®DSI (4 DSI RX lanes, 1 Gbps/lane), DPI (up to 154 MHz)
  • Panel interface: VESA DisplayPort® 1.1a (Single/Dual lane, 1.62 or 2.7 Gbps/lane)
    - WUXGA: Up to (1920 × 1200, 24 bpp)
    - HDCP 1.3
  • I2C (slave) and SPI (slave) interfaces for internal register access
  • Audio interface: I2S

General Specifications

General Specifications of the TC358766XBG
Part number TC358766XBG
Package Image
The product photograph of TC358766XBG.
Summary PDF Product Brief (166KB)
Supply voltages 1.2 V (Core)、1.2 V & 1.8 V (DisplayPort®) 、1.2 V (MIPI® D-PHY I/O)
1.8 V -3.3 V (I/O)
Package dimensions BGA120 (120 balls)
6.0 mm × 6.0 mm, 0.5 mm ball pitch
Status/Availability Mass Production

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MIPI® DSI/DPI to DisplayPort® Display Interface Bridge /TC358767AXBG

Features

  • Host interface: MIPI®DSI (4 DSI RX lanes, 1 Gbps/lane)
  • Panel interface: VESA DisplayPort® 1.1a (Single/Dual lane, 1.62 or 2.7 Gbps/lane)
    - WUXGA: Up to (1920 × 1200, 24 bpp)
    - HDCP 1.3
  • I2C (slave) and SPI (slave) interfaces for internal register access
  • Audio interface: I2S

General Specifications

General Specifications of the TC358767AXBG
Part number TC358767AXBG
Package Image
The product photograph of TC358767AXBG.
Supply voltages 1.2 V (Core), 1.2 V & 1.8 V (DisplayPort®), 1.2 V (MIPI® D-PHY I/O)
1.8 V -3.3 V (I/O)
Package dimensions BGA81 (81 balls)
5.0 mm × 5.0 mm, 0.5 mm ball pitch
Status/Availability Mass Production

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MIPI® DPI to MIPI® DSI Display Interface Bridge /TC358768AXBG/TC358778XBG

Features

  • Host interface: MIPI® DPI (up to 154 MHz)
  • Panel interface: MIPI® DSI (4 DSI TX lanes, 1 Gbps/lane)
  • WUXGA: Up to (1920 × 1200, 24 bpp)
  • I2C (slave) and SPI (slave) interfaces for internal register access

General Specifications

General Specifications of the TC358768AXBG,TC358778XBG
Part number TC358768AXBG TC358778XBG
Package Image
The product photograph of TC358768AXBG.
The product photograph of TC358778XBG.
Supply voltages 1.2 V (Core), 1.8 V - 3.3 V (I/O), 1.2 V (MIPI® I/O)
Package dimensions BGA72 (72 balls)
4.5 mm × 4.5 mm, 0.4 mm ball pitch
BGA80 (80balls)
7 mm × 7 mm, 0.65 mm ball pitch
Status/Availability Mass Production Mass Production

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MIPI® DSI/DPI to DisplayPort® Display Interface Bridge /TC358770AXBG/TC358777XBG

Features

  • Host interface: MIPI®DSI (4 DSI RX lanes x 2ch, 1 Gbps/lane)
  • Panel interface: VESA DisplayPort® 1.1a (Up to 4 lanes, 1.62 or 2.7 Gbps/lane)
    - QSXGA: Up to (2560 × 2048, 24 bpp)
    - HDCP 1.3
  • I2C (slave) and SPI (slave) interfaces for internal register access
  • Audio interface: I2S

General Specifications

General Specifications of the TC358770AXBG, TC358777XBG 
Part number TC358770AXBG TC358777XBG
Package Image
The product photograph of TC358770AXBG.
The product photograph of TC358777XBG.
Supply voltages 1.2 V (Core)、1.2 V & 1.8 V(DisplayPort®) 、1.2 V (MIPI® D-PHYI/O)
1.8 V -3.3 V (I/O)
Package dimensions BGA100 (100 balls)
5.0 mm x 5.0 mm, 0.4 mm ball pitch
BGA80(80 balls)
7 mm x 7 mm, 0.65 mm ball pitch
Status/Availability Mass production Mass production
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)  

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MIPI®DSI to LVDS Display Interface Bridge /TC358774/TC358775XBG

Features

  • Host interface: MIPI® DSI(4 DSI RX lanes)
  • Single Link(TC358774XBG), Dual Link (TC358775XBG)
  • I2C (master) and GPIO interfaces for peripheral device control and I2C (slave) interface for on-chip register programming
  • TC358774XBG: Up to UXGA resolution (1600 × 1200, 24 bpp)
    TC358775XBG: Up to WUXGA resolution (1920 × 1200, 24 bpp)
  • Low power version of the TC358764XBG and TC358765XBG

General Specifications

General Specifications of the TC358774XBG, TC358775XBG
Part Number TC358774XBG TC358775XBG
Package Image
The product photograph of TC358774XBG.
The product photograph of TC358775XBG.
Supply voltages 1.2 V (Core), 1.2 V (MIPI® D-PHY I/O),
3.3 V (LVDS I/O), 1.8 V -3.3 V (I/O)
Package dimensions BGA49 (49 balls)
5.0 mm × 5.0 mm, 0.65 mm Ball pitch
BGA64(64 balls)
6.0 mm × 6.0 mm, 0.65 mm Ball pitch
Status/Availability Mass Production Mass Production
Product Brief  (Jump to Toshiba America Electronic Components, Inc. Site)

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