Camera Interface Bridge (HDMI® Interface Bridge included)

Camera resolutions are becoming higher. The camera Interface bridge enables high-speed transfer of camera image data.

Block Diagram of Camera Interface Bridge.

 

HDMI® to MIPI® CSI-2 Interface Bridge IC Integrating De-Interlacing and Video Scaling /TC358749XBG

Reduces Workload on Host Processor for Video Preprocessing

The TC358749XBG is an HDMI®-to-MIPI® interface bridge IC that integrates video de-interlacing and video scaling for commercial and industrial applications with an HDMI® input.

The TC358749XBG's integrated video preprocessing functions of video de-interlacing, video scaling and video format conversion replace software processing and significantly reduce the memory bandwidth requirement of and the workload on the host processor.

The TC358749XBG supports multiple audio interfaces, including I2S, TDM, S/PDIF, and MIPI® Serial Low-power Inter-chip Media Bus (SLIMbus®), making it suitable for a wide range of applications.

Key Features

Integrated video de-interlacing, video scaling and video format conversion, contributing to reduce memory bandwidth and video processing requirements on the host processors.
HDMI® 1.4 support
  • Up to 1080P @ 60fps video format (RGB, YcbCr444: 24-bpp, YcbCr422 24-bpp)
  • HDCP 1.3
  • 3D support
Availability of any of the four audio interfaces: I2S, TDM, SPDIF or SLIMbus®
Maximum 1Gbps/lane link speed MIPI® CSI2 interface
Maximum 165MHz HDMI clock speed

Applications

A wide range of consumer electronics and industrial applications, such as smart set-top boxes, smart TVs, smart monitors, and small form-factor PCs

Main specifications

Par Number TC358749XBG
Package Image
The product photograph of TC358749XBG.
Input Interface HDMI® 1.4
Clock speed 165MHz (Max)
Output Video Interface MIPI® CSI-2 4 Data lanes (Up to 1Gbps/lane)
Output Audio Interface I2S, TDM, SPDIF or SLIMbus®
Source Voltage MIPI®/Core/PLL: 1.2V
HDMI®: 3.3V
I/O: 1.8V-3.3V
Package BGA80 (80 balls) 7.0mm×7.0mm, 0.65mm ball pitch)
Mass Production Schedule April, 2014
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)

Notes:

  • * HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
  • * MIPI and SLIMbus are registered trademarks of MIPI Alliance, Inc.

MIPI® CSI-2 ⇔ Parallel Interface Camera Interface Bridge /TC358746AXBG /TC358748XBG

Features

  • MIPI interface: Compliant with MIPI® CSI-2 (4 CSI TX/RX lanes, 1 Gbps/lane)
  • Parallel interface: Up to 24 bits (PCLK: Up to 154 MHz in input mode and up to 100 MHz in output mode)
  • I2C (slave) interface for internal register access
  • Data format:
    RGB888/666/565
    RAW8/10/12/14
    YUV422 (CCIR/ITU 8/10-bit)
    YUV444 (Only parallel input mode)
    YUV422 8-bit – ITU BT.656 and ITU BT.601 (Only parallel input mode)

General Specifications

General Specifications of the TC358746AXBG, TC358748XBG
Par Number TC358746AXBG TC358748XBG
Package Image
The product photograph of TC358746AXBG.
The product photograph of TC358748XBG.
Supply voltages 1.2 V (Core)、1.8 V - 3.3 V (I/O)、1.2 V (MIPI® D-PHY I/O)
Package dimensions BGA72 (72 balls)
4.5 mm × 4.5 mm, 0.4 mm Ball pitch
BGA80 (80 balls)
7.0 mm × 7.0 mm, 0.65 mm Ball pitch
Status/Availability Mass Production
Product Brief (Jump to Toshiba America Electronic Components, Inc. Site)  
  • MIPI® word marks and logos are registered service marks owned by MIPI® Alliance, Inc.

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HDMI® to MIPI® CSI-2 Video Signal Interface Bridge /TC358743XBG

Features

  • MIPI interface: Compliant with MIPI® CSI-2 (4 CSI TX lanes, 1 Gbps/lane)
  • HDMI interface: HDMI 1.4
    - Supported video format: Up to 1080p @60 fps
    - Audio system support
    - 3D support
    - HDCP 1.3
    - DDC
    - EDID
    - Maximum HDMI clock frequency: 165 MHz
  • Audio output interface: I2S or TMD
  • I2C (slave) interface for internal register access

General Specifications

General Specifications of the TC358743XBG
Package Image
The product photograph of TC358743XBG.
Summary PDF Product Brief (188KB)
Supply voltages 1.2 V (Core), 1.2 V & 3.3 V (HDMI), 1.2 V (MIPI® D-PHY I/O)
1.8 V-3.3 V (I/O), 2.5 V (APLL)
Package dimensions BGA64 (64 balls)
6.0 mm × 6.0 mm , 0.65mm ball pitch
Status/Availability Mass Production

 

  • * MIPI® word marks and logos are registered service marks owned by MIPI® Alliance, Inc.
  • * HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.

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