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Embedded DRAM (eDRAM) ASICs

The low-power and high-bandwidth characteristics of Toshiba's embedded DRAM make it ideal for a wide range of applications, including video/image processing devices such as graphics and display controllers; storage devices such as HDD controllers; and digital communication and networking devices.

Key Features of DRAM Cores
  1. Much denser than SRAM
  2. High performance with fast data transfer rates due to wide on-chip memory buses, compared to commodity DRAMs.
  3. Low power
  4. Built-in test circuitry and redundancy circuitry
  5. Flexible core cells generated by a DRAM macro generator

Features of Toshiba's DRAM Cores

Trench Process
The one-transistor (1T) DRAM cell structure utilizes the trench process. The trench capacitor allows for a planar surface topology that enhances reliability without compromising logic performance.
High Bandwidth
Freed from I/O restrictions, embedded DRAM cores provide high memory bandwidth with synchronous interface and a bus width selectable from 64, 128 and 256 bits.
Configurable Macros
DRAM macros are configurable in depth and width to suit particular application requirements, allowing great system flexibility.
Low Power Consumption
DRAM macros consume less than 5% of power, compared to commodity DRAMs.

DRAM Cores for the TC320 Series

DRAM cores are available for the TC320C cell-based ICs. All primitive cells and I/O cells for the TC320C can be used without compromising their performance.

Specifications of DRAM Cores for the TC320C Cell-Based IC Series
Characteristics LP
Random Access Cycle Time 32 ns
Latency 1, 2, 3
Max Clock Frequency (Page Mode) 250 MHz
Memory Capacity 4 to 32 Mb
Bit Width 64/128/256

DRAM Cores for the TC300 Series

DRAM cores are available for the TC300C cell-based ICs. All primitive cells and I/O cells for the TC300C can be used without compromising their performance.

Specifications of DRAM Cores for the TC300C Cell-Based IC Series
Characteristics SD SD (LP)*
Random Access Cycle Time 36 ns 40 ns
Latency 1, 2, 3 1, 2, 3
First Data Output Time - -
Max Clock Frequency (Page Mode) 222 MHz 200 MHz
Memory Capacity 4 to 32 Mb 4 to 32 Mb
Bit Width 64/128/256 64/128/256
  • *: The LP version consumes 1/10 the standby current of standard SD macros.

DRAM Cores for the TC280 Series

The TC280C cell-based ASIC series offers a variety of embedded DRAM cores. Designers can use the same primitive and I/O cells as well as any IP cores available for the TC280C pure logic process without compromising logic performance. The DRAM cores for the TC280 series have the following two types:

Standard Synchronous DRAM (SD) Macros
The standard SD macros are available in a variety of capacities and operate over a wide range of clock frequencies.
The SD macros are suitable for applications requiring fast page-mode accesses.
Fast-Access DRAM Macros with Faster Random Access and Data Output
Two types of the fast-access (FA) DRAM macros offer significant advantages over the SD macros in random-access cycle time or data output times.
  1. FA-RC macros have fast random-access cycle times.
    The FA-RC macros are ideal for applications requiring fast random accesses.
  2. FA-AC macros have fast first data output times.
    The FA-AC macros achieve the fast page-mode access.
Specifications of DRAM Cores for the TC280C Cell-Based IC Series
Characteristics SD FA-RC FA-AC
Random Access Cycle Time 40 ns 10 ns 12 ns
Latency 1, 2, 3 1, 2 2
First Data Output Time - 14 ns 10 ns
Max Clock Frequency (Page Mode) 200 MHz - 200 MHz
Memory Capacity 4 to 32 Mbits 2 to 9 Mbits 2 to 9 Mbits
Bit Width 64/128/256 128/144/256/288 128/144/256/288

DRAM Cores for the TC260 Series

The DRAM cores for the TC260 series having 0.14-μm gate length is fabricated using the 0.14-μm process technology. SD and FA cores are available.

Specifications of DRAM Cores for the TC260 Series
Characteristics SD FA
Random Access Cycle Time 48 ns 15 ns 12 ns 15 ns
Latency 1, 2, 3 1 2 2
Max Clock Frequency (Page Mode) 181 MHz - - 200 MHz
Memory Capacity 2 to 32 Mbits 2 Mbits, 4 Mbits

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