Legacy Packages
Quad Flat Package(QFP) Features
-
- Features: Low profile and cost effective
- Structure: The die is attached to a die attach paddle with an adhesive and wire-bonded to leadframes in an overmolded package body.
- Intended Use: Consumer equipment, office equipment, etc.
- Lead Pitch: 0.40 / 0.50 / 0.65 / 0.8 / 1.0 (mm)
- Body size: 7 x 7 to 28 x 28(mm)
- Lead Count: 44 to 256
QFP Lineup
| Package Style | Mounting Height (max) (mm) |
Body Size (mm) |
Lead Pitch (mm) |
Lead Count |
|---|---|---|---|---|
| QFP | 3.05/3.15*1 | 14×20 | 1.0 | 64 |
| 0.8 | 80 | |||
| 0.65 | 100 | |||
| LQFP | 1.6/1.7*1 | 7×7 | 0.5 | 48 |
| 10×10 | 0.8 | 44 | ||
| 0.5 | 64 | |||
| 12×12 | 0.5 | 80 | ||
| 14×14 | 0.5 | 100 | ||
| 0.4 | 128 | |||
| 16×16 | 0.4 | 144 | ||
| 20×20 | 0.5 | 144 | ||
| 0.4 | 176 | |||
| 24×24 | 0.5 | 176 | ||
| 0.4 | 216 | |||
| 28×28 | 0.5 | 208 | ||
| 0.4 | 256 | |||
| TQFP | 1.2 | 14×14 | 0.5 | 100 |
| 0.4 | 128 |
- *1:For information on the package body size versus mounting height, contact your local Toshiba sales representative.
Click here to view detailed information on package dimensions.
Contacts
If you have any queries, click one of these links:
- Technical queries
- Queries about purchasing, sampling and IC reliability