State-of-the-Art Packages
Features of System in Package(SiP)
System-in-a-Package (SiP) refers to a semiconductor device that incorporates multiple readily available chips into a single package; while System-on-a-Chip (SoC) refers to a device that incorporates a system of differently functioning circuit blocks on a single silicon chip.
- Advantages of SiP
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- Space savings
- Reduced EMC emissions
- Conventional chip: Reduction in inductance
- New chip: Reduction in inductance + Optimization of I/O drivers + Optimization of I/O-to-I/O interconnection
- Reduced power consumption
- Conventional chip: Reduction in external load capacitance
- New chip: + Optimization of I/O drivers
- Simplifies system design.
- Simplifies board design.
- SiP Disadvantages
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- Integration difficulties due to higher pin counts
- Different test specifications and methods required by each system block
- Complex component/chip procurement
- Complex thermal design requirements
- Difficult to maintain packaging reliability
Choices Between SiP and SoC
SiPs and SoCs can be selectively used according to the cost requirements and whether to reuse existing chips.
Types of SiPs
- 2-Chip Stacked SiP 1
- 2-Chip Side-by-Side SiP
- 2-Chip Stacked SiP 2
- 4-Chip Stacked & Side-by-Side SiP
Examples of SiPs that are already in full production
- Leadframe-Based 3-Chip Stacked SiP
- Laminate-Based 6-Chip Stacked SiP
Contacts
If you have any queries, click one of these links:
- Technical queries
- Queries about purchasing, sampling and IC reliability