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Package Introduction

Package Offerings

Package requirements vary with each application system in which ASICs are incorporated. To satisfy all application needs, Toshiba offers a broad range of packaging options, based on small-form-factor and lightweight, low-profile, high-pin-count, high-speed and thermal dissipation technologies.

This figure shows a package roadmap.

State-of-the-Art Packages

Legacy Packages

Small Packages

This figure shows the recommended packages for applications requiring size reduction.

RoHS Compatibility

Please contact your local Toshiba sales representative for information about RoHS compatibility and halogen-free status of the ASIC products from Toshiba Corporation Semiconductor & Storage Products Company and its subsidiaries.


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