ASICs / Structured Arrays
Package requirements vary with each application system in which ASICs are incorporated. To satisfy all application needs, Toshiba offers a broad range of packaging options, based on small-form-factor and lightweight, low-profile, high-pin-count, high-speed and thermal dissipation technologies.
Please contact your local Toshiba sales representative for information about RoHS compatibility and halogen-free status of the ASIC products from Toshiba Corporation Semiconductor & Storage Products Company and its subsidiaries.
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