ASICs

Product Introduction

Toshiba's ASIC offerings include gate arrays, suitable for short delivery times, cell-based ICs which enable higher integration with enhanced features, as well as embedded arrays which have advantages in both development schedules and integration/features.

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Technical Information

CPS (Chip-Package-System) Codesign/Coverification Technology

Toshiba has developed a chip-package-system (CPS) codesign/coverification platform. Its concept is collaborative development of the chip, package and PCB system board by creating an accurate virtual package model before the designing of a package substrate begins based on the final specification of the integrated chip-package design. Chip-package-system codesign allows optimal cost/performance trade-offs, reduces IC and system development times and improves verification accuracy prior to actual system hardware prototyping.
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News Release

News releases of Toshiba's ASICs products are posted.

Toshiba's New SoC Design Platform Shortens Turn-Around-Times ( 26 Jan, 2005 )
TOSHIBA LICENSES ARM11 FAMILY PROCESSOR ( 08 Nov, 2004 )

Documents

ASICs Product list

General Catalog (ASICs) (PDF:134KB) Aug,2009

Catalogs

CMOS ASICs (PDF:1007KB) Mar,2007