Targets and Outcomes

Since the launch of the "1st Environmental Action Plan" in FY 1993, Toshiba Group has been implementing a higher level of environmental activities as it extended the plan to the 2 nd and 3 rd phases with expanded items, goals, and sites. In accordance with the "4 th Environmental Action Plan," effective until FY 2012, the group is currently striving for improvement of efficiency in both products and business processes.
Toshiba Semiconductor & Storage Products Company Group is also making efforts to achieve the targets under the 4 th Environmental Action Plan. This Chapter contains separate summaries of the targets and achievements in FY 2010 for the former Semiconductor Company and former Storage Products Company.

Achievement of the annual plan by the former Semiconductor Company Group(Achievements in FY 2010)
Achievement of the annual plan by the former Storage Products Company Group (Achievements of FY 2010)

Achievement of the annual plan by the former Semiconductor Company Group (Achievements in FY 2010)

The former Semiconductor Company had set stricter values than those in the environmental action plan in regard to greenhouse gas emissions, the total amount of generated wastes, and the quantity of received water, etc. in the annual plan for FY 2010, but targets were not achieved in three items by a narrow margin. With regard to reduction of energy-originated CO₂ emissions and CO₂ emissions associate with domestic product logistics, CO₂ emissions rose due to increased production in some of the manufacturing lines, and this value exceeded the target. The former Semiconductor Company also failed to achieve the target for emissions of chemical substances to air and water by a narrow margin because the contribution of abatement system appeared later than scheduled. Despite these setbacks, we did achieve the target amount of reduction of PFC emissions, thanks to the introduction of abatement systems. We also achieved the target of waste sent to landfill being less than 0.5 % by promoting the thorough recycling of resources.

We will continue to develop more effective energy conservation activities by the adoption of LED lighting and introduction of waste heat recovery measures, and proceed with a general policy of introducing VOC (volatile organic compound) abatement tools to reduce the emission of chemical substances.

**Results of former Semiconductor Company Group's Achievement of Targets in FY 2010**
Item	Indicator	Baseline	FY2010 Result			FY2011
Item	Indicator	Baseline	Plan	Result	Evaluation	Plan
Reduction of energy-originated CO₂ emissions	Total emissions	–	1,139 thousand ton or less	1,150 thousand ton	-	1,199 thousand ton or less
Reductions of total emissions of certain greenhouse gases, excluding CO₂^*2	Total emissions	CY 1995	88 % or less	87 %		83 % or less
Reduction of CO₂ emissions associated with domestic (within Japan) product logistics	Emission rate^3 (For FY 2011 target, this item applies rate^1)	FY 2005 (For FY 2011 target, baseline year is FY 2000)	55 % or less	56 %	-	37 % or less
Emissions of chemical substances to air and water (total amount)	Total emissions	FY 2000	219 % or less	222 % of the baseline year	-	189 % or less
Reduction in the total amount of waste generated	Rate of the total amount of waste generated^*1	FY 2000	67 % or less	63 %		63 % or less
Waste sent to landfill < 0.5 % at manufacturing sites^*3	Number of sites where target was achieved	-	All sites	All sites		All sites
Reduction of water intake	Water intake rate^*1	FY 2000	47 % or less	44 %		41 % or less

₂

*1: Rates used as indicators are based on net output (per unit of output normalized by deflator).
Net output = [Nominal output in Japan] ÷ [Corporate goods price index ( for electrical equipment) announced by Bank of Japan: Ratio of each year based on the index in 1990 as 1] + [Nominal output at sites outside of Japan]
*2: CF₄, C₂F₆, C₃F₈, C₄F₈, CHF₃, SF₆, and NF₃
*3: This index means emissions per unit of output
*4: Waste sent to landfill < 0.5 % at manufacturing sites means that the final disposal rate, or amount of waste sent to landfill after treatment, is less than 0.5% of the total amount by weight of byproducts and other waste items generated (total waste discharged) as a result of business activities at each of former Semiconductor Company Group's manufacturing sites.
In addition, our non-manufacturing sites in Japan have a target to achieve a final disposal rate of 1.0 % or less.

Achievement of the annual plan by the former Storage Products Company Group (Achievements of FY 2010)

The former Storage Products Company set the targets for environmental impact per product unit in greenhouse gas emissions, chemical substance emissions and the amount of water intake in the annual plan for FY 2010 and proceeded with preservation efforts. We failed to achieve the targets in the reduction ratio of chemical substances, waste and water intake per product unit due to an overall decrease in the production of storage products. As for waste sent to landfill being less than 0.5 %, the reduction of the final disposal of wasted paper and other items at some worksites did not proceed as planned, and we failed to achieve the target. We will develop cross-platform measures among our plants to achieve the targets by improving the final disposal ratio and conducting other activities.

**Results of former Storage Products Company Group's Achievement of Targets in FY 2010**
Item	Indicator	Baseline	FY 2010 Result			FY 2011
Item	Indicator	Baseline	Plan	Result	Evaluation	Plan
Reduction of energy-originated CO₂ emissions	Emissions per unit number of production^*1	FY 2009	Reduction of 1 % or more	1 % reduction		Reduction of 2 % or more
Reduction of CO₂ emissions associated with domestic (within Japan) product logistics	Emissions per unit number of shipping^*2	FY 2009	Reduction of 1 % or more	19 % reduction		Reduction of 2 % or more
Emissions of chemical substances to air and water (total amount)	Emissions per unit number of production^*1	FY 2009	Reduction of 2 % or more	43 % increase	-	Reduction of 4 % or more
Reduction in the total amount of waste generated	waste disposal per unit number of production^*1	FY 2009	Reduction of 1 % or more	0.8% reduction	-	Reduction of 2 % or more
Waste sent to landfill < 0.5 % at manufacturing sites ^*3	Final disposal rate (manufacturing site)	-	Less than 1 %	3.6 %	-	Less than 0.5 %
Reduction of water intake	Water intake per unit number of production^*1	FY 2009	Reduction of 1 % or more	5 % increase	-	Reduction of 2 % or more

*1: Emissions per unit number of production means the emissions amount per one unit of production.
*3: Emissions per unit number of shipping means the emissions amount per one unit of shipping.
*4: "Waste sent to landfill < 0.5 % at manufacturing sites" means that the final disposal rate, or amount of waste sent to landfill after treatment, is less than 0.5 % of the total amount by weight of byproducts and other waste items generated (total waste discharged) as a result of business activities at each of former Storage Products Company Group's manufacturing sites worldwide.
In addition, our non-manufacturing sites in Japan have a target to achieve a final disposal rate of 1.0 % or less.
We put FY 2011 target of Semiconductor & Storage Company in this chart.