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On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes previous Semiconductor Company's environmental activities.

Actions Related to RoHS Directive

1. RoHS Directive

DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL OF 27 January 2003 on the restriction of the use of certain hazardous substances ("RoHS Directive") prohibit from July 1, 2006 manufacturers from placing on the EU market any new Electrical and Electronic Equipment (EEE) containing more than certain specified levels of the following substances:

  1. Lead and its compounds
  2. Cadmium and its compounds
  3. Mercury and its compounds
  4. Hexavalent chromium and its compounds
  5. Polybrominated biphenyls (PBBs)
  6. Polybrominated diphenyl ethers (PBDEs)

There are a number of exempted applications for these substances. Manufacturers need to ensure that their products and the components of such products comply with the requirements of the RoHS Directive as well as associated country-specific regulations.

Some examples of exempted applications in the RoHS Directive specific to semiconductors are described below, but these should not be understood as exhaustive or complete. In order to correctly understand the exemptions contained in the RoHS Directive, please study the RoHS Directive itself. As the RoHS Directive and its country-specific implementations are likely to be revised from time to time, please be sure to remain updated with the most recent information.

Examples of exempted applications
  • Lead contained in solder with a high melting point (i.e.: tin/lead solder alloy with lead content exceeding 85%)
  • Lead contained in solder which is composed of several elements used for connection between the pin and the package of a microprocessor, with a lead content of more than 80% and less than 85% in weight.
  • Lead contained in solder used for the electrical connection between the semiconductor die and the carrier in the flip chip package of the integrated circuit.

2. Notice

Information regarding Toshiba Semiconductor Company's change in packing labels to include indications regarding the European RoHS Directive (6 February 2006)

Toshiba Semiconductor Company now indicates the relationship between our products and the European RoHS Directive on the packaging labels of the shipping boxes. Here are examples of the labels for our RoHS-Compatible products. For more information, please contact our sales department.

Examples of label indications for European RoHS-Compatible products

Example 1: Products which do not contain restricted chemical substances in quantities exceeding the maximum concentration value permitted by the RoHS Directive

Example 2: RoHS Directive in a quantity that exceeds the permitted maximum concentration value, but which fall within the application exemptions in the Directive.

3. Definition of terms used by Toshiba Semiconductor Company regarding the RoHS Directive

Toshiba Semiconductor Company's definitions of terms relating to the handling of substances restricted by regulations can be found at the following link.

Definition of terms (May, 2007 updated , PDF: 68KB): (This page opens in a different window)

4. Attention

Before purchasing our products, please confirm the RoHS compatibility status with our sales department.

On July 1st, Toshiba Corporation's Semiconductor Company and Storage Products Company consolidated to form Semiconductor & Storage Products Company.This page describes previous Semiconductor Company's environmental activities.

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