- Reliability Information (Reliability Handbook)
- Commitment to Quality
- Semiconductor Device Reliability
- Handling Precautions
- General Usage Considerations
- Usage Considerations Specific to Each Product Group
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Usage Considerations Specific to Each Product Group
[As of February, 2014]
This section describes the matters specific to each product group which need to be taken into consideration. The precautions described in this section take precedence over those described in "General Usage Considerations."
- Optical Semiconductor Products
- Power Devices
- Application Specific ICs and General-Purpose Linear ICs
- CCD Image Sensors
- Camera Module Products
This section lists important precautions which users of semiconductor devices (and anyone else) should observe in order to avoid injury to human body and damage to property, and to ensure safe and correct use of our products. Please be sure that you understand the meanings of the labels and graphic symbols described below before you move on to the detailed descriptions of the precautions, and comply with the precautions stated.
|Indicates a hazardous situation which, if not avoided, will result in death or serious injury1.||Indicates a hazardous situation which, if not avoided, could result in death or serious injury1.||Indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury2.||Indicates practices that may cause property damage3 and other problems, but not personal injury.|
- Serious injury includes blindness, wounds, burns (low and high temperature), electric shock, fractures, and poisoning, etc. with long-lasting effects or that require hospitalization and/or long-term hospital visits for treatment.
- Minor or moderate injury includes wounds, burns, electric shock, etc. not requiring hospitalization and/or long-term hospital visits for treatment.
- Property damage means damage to customer or third party machines and equipment.
|Indicates prohibited actions.||Indicates actions that must be undertaken for safety purposes.|
General Precautions Regarding Semiconductor Products
|The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.
|Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.|
|Do not touch the device and its heat sink while the device is on or immediately after the device has been turned off.
Devices and Heat sinks become hot. Contact to the heat sink may result in a burn.
|Do not touch the lead tips of a device.
Some devices have leads with sharp tips. Contact to sharp tips may result in a puncture wound.
|Check that there is no electrical leakage before grounding measuring equipment or a solder iron.
Electrical leakage may cause electric shock or the device you are testing or soldering to electrically break down.
|On the evaluation, inspection or test, be sure to connect the test equipment's electrodes or probes to the pins of the device before turning the power on. When you have finished, discharge any electrical charge remaining in the device.
Failure to do so may cause electric shock, resulting in injury.
|Always wear safety glasses when cutting the leads of a device with clippers or a similar tool.
Failure to do so may result in eye damage from the small shavings that fly off the cut ends.